Stephen Batcup

Research Officer

School of Engineering, Swansea University

  • College of Engineering, Faraday building, Swansea University, Singleton Park,
    Swansea, SA2 8PP
  • 01792 295690
  • s.g.batcup@swan.ac.uk

Experience

Stephen has many years of experience working in the area of Power Electronics, both at the semiconductor device level and at the systems level. His experience spans both manufacturing industry, where he was Product Engineer for Siliconix, and academia, where he has worked on many research projects related to Power devices and Power systems within Swansea University. He frequently works on projects which are collaborations between Swansea University and Industry. Typically, these projects will be short-term and focussed on a specific Power Electronics detail. He has experience of circuit design and fabrication, system design (including programmable systems) as well as test & measurement expertise.

Role in SOLCER

Stephen’s role within SOLCER is to work on the design and implementation of DC distribution networks at the nano- and micro- grid levels (i.e. domestic-scale grids). He will bring power electronics and power system expertise into the team while analysing, interpreting and incorporating research from other team members into the design of power system hardware. The DC networks developed within SOLCER will incorporate programmable devices for power systems management. His role will include developing strategies for power load management to ensure the most efficient use of available electrical energy at any given time, to source the equipment required, and to implement these strategies into functional demonstrators.

Publications

2001 Dynamic Electro-Thermal Physically Based Compact Models of the Power Devices for Device and Circuit Simulations. P.M. Igic, P.A. Mawby, M.S. Towers and S. Batcup. Seventeenth IEEE SEMI-THERM Symposium (2001)

2002 Investigation of the power dissipation during IGBT turn-off using a new physics-based IGBT compact model. P.M. Igic,P.A. Mawby,M.S. Towers,W. Jamal,S. Batcup. Microelectronics Reliability Vol. 42 Issue 7 (2002) pp 1045–1052.

2002 New Physically-Based PiN Diode Compact Model for Circuit Modelling Applications. P.M. Igic, P.A. Mawby, M.S. Towers and S. Batcup. IEEE Proceedings Circuits, Devices & Systems, Vol. 149 No. 4, pp257-263 August 2002

2002 Thermal Model of Power Semiconductor Devices for Electro-Thermal Circuit Simulations. P.M. Igic, P.A. Mawby, M.S. Towers and S. Batcup. 23rd International Conference on Microelectronics (MIEL 2002), VOL 1 pp171-174 (2002)

2005 Report on 4H-SiC JTE Schottky diodes. L. Chen a, O.J. Guy, D. Doneddu, S.G.J. Batcup, S.P. Wilks,
P.A. Mawby, T. Bouchet, F. Torregrosa. Microelectronics Reliability Vol. 46 (2006) pp 637–640

2005 Simplified Method of Determining Diode Temperature Coefficient. Steve Batcup, Phil Mawby, Petar Igic. Microtherm International Conference on Microtechnology and Thermal Problems in Electronics (2005)

2006 An advanced physics-based sub-circuit model of IGBT. Nebosja Jankovic, Zhongfu Zhou, Steve Batcup, Petar Igic. IEEE International Symposium on Industrial Electronics Vols. 1-4 pp 447-452 (2006)

2006 Dynamic Thermal Simulation of Power Devices Operating with PWM Signals. Z. Zhou, M. S. Khanniche, P. Igic, S, N.Jankovic, S. G. Batcup, P. A. Mawby. 25th International Conference on Microelectronics (MIEL) Vols. 1&2 pp193-196 (2006)

2006 Technology for Power Integrated Circuits with Multiple Vertical Power Devices. Petar Igic, Paul Holland, Steve Batcup, Ralf Lerner and Andreas Menz. Proceedings in the 18th International Symposium on Power Semiconductor Devices & IC's, ISPSD. Pp 229-232 (2006)

2007 Correlation of Thermal Resistance Measurements with Die Attach Evaluation and SOA Performance. Steve Batcup, Petar Igic. Microtherm International Conference on Microtechnology and Thermal Problems in Electronics (2007)

2008 A Study of Latch-up Robustness for a New p-Buffer CMOS based Power IC Technology Architecture. P.M. Holland, M. P. Elwin, S. Batcup, Z. Zhou and P. M. Igic. 26th International Conference on Microelectronics (MIEL) Vols 1&2 pp177-179 (2008)

2008 Characterization of MOS Interfaces on Protected and Un-protected 4H-SiC Surfaces. M. Lodzinski, A. Perez-Tomas, O.J. Guy, M. Penny, S. Batcup, O.A Al-Hartomy, P. Dunstan, S. Wilks and P. Igic. 26th International Conference on Microelectronics (MIEL) vols. 1&2 pp541-543 (2008)

2008 Metal Contacts to Boron-Doped Diamond. M. Lodzinski, O.J. Guy, A.Castaing, S. Batcup, S. Wilks, P. Igic, R. S. Balmer, C. J. H. Wort, R. Lang. Materials Science Forum, Silicon Carbide and related materials Vol. 615 – 617. Pp995-998 (2008)

2010 High-speed electro-thermal simulation model of inverter power modules for hybrid vehicles. Z. Zhou M.S. Kanniche S.G. Butcup P. Igic. IET Electric Power Applications, Vol . 5, Issue 8, pp636-643 (2011)

2011 A Predictive Dead-Beat PI Current Controller for Active Power Filters. C. Wang, Z. Zhou, Y. Liu, M. S. Kanniche, P.M. Holland, R.P.Lewis, S.G. Batcup, and P. Igic. Proceedings of the 2011-14th European Conference on Power Electronics and Applications (EPE 2011)

2012 A lateral double-diffused magnetic sensitive metal-oxide-semiconductor field-effect transistor with integrated n-type Hall plate. N. Jankovic´, D. Pantic´, S. Batcup, and P. Igic´. Journal of Applied Physics, Applied Physics Letters 100, 263507 (2012)

2012 Modification of Schottky Interface by the Inclusion of DNA Interlayer to Create Metal-Organic-Inorganic Structures. Stephen Batcup, John Wills, Michal Lodzinski, Chris Wright,
Shareen Doak, Paul Holland and Petar Igic. 28th International Conference on Microelectronics (MIEL) (2012)